%0 Conference Paper %1 conf/isqed/ChanKL13 %A Chan, Tuck-Boon %A Kahng, Andrew B. %A Li, Jiajia %B ISQED %D 2013 %I IEEE %K dblp %P 16-23 %T Reliability-constrained die stacking order in 3DICs under manufacturing variability. %U http://dblp.uni-trier.de/db/conf/isqed/isqed2013.html#ChanKL13 %@ 978-1-4673-4951-2

@inproceedings{conf/isqed/ChanKL13, added-at = {2020-07-15T00:00:00.000+0200}, author = {Chan, Tuck-Boon and Kahng, Andrew B. and Li, Jiajia}, biburl = {https://www.bibsonomy.org/bibtex/2684bd8f8c273618502f6ea2d5e46ebc5/dblp}, booktitle = {ISQED}, crossref = {conf/isqed/2013}, ee = {https://doi.org/10.1109/ISQED.2013.6523584}, interhash = {0b76aba5ed93eb2c147c7489dbe07f07}, intrahash = {684bd8f8c273618502f6ea2d5e46ebc5}, isbn = {978-1-4673-4951-2}, keywords = {dblp}, pages = {16-23}, publisher = {IEEE}, timestamp = {2020-07-24T01:14:36.000+0200}, title = {Reliability-constrained die stacking order in 3DICs under manufacturing variability.}, url = {http://dblp.uni-trier.de/db/conf/isqed/isqed2013.html#ChanKL13}, year = 2013 }