%0 Journal Article %1 journals/mr/LeeS07 %A Lee, J. G. %A Subramanian, K. N. %D 2007 %J Microelectron. Reliab. %K dblp %N 1 %P 118-131 %T Effects of TMF heating rates on damage accumulation and resultant mechanical behavior of Sn-Ag based solder joints. %U http://dblp.uni-trier.de/db/journals/mr/mr47.html#LeeS07 %V 47

@article{journals/mr/LeeS07, added-at = {2020-02-22T00:00:00.000+0100}, author = {Lee, J. G. and Subramanian, K. N.}, biburl = {https://www.bibsonomy.org/bibtex/2450bd1ee8168d88ad92bb0b1a9592668/dblp}, ee = {https://doi.org/10.1016/j.microrel.2006.02.001}, interhash = {13c5f20384b5ad77fdd38115726b8e3d}, intrahash = {450bd1ee8168d88ad92bb0b1a9592668}, journal = {Microelectron. Reliab.}, keywords = {dblp}, number = 1, pages = {118-131}, timestamp = {2020-02-25T13:28:25.000+0100}, title = {Effects of TMF heating rates on damage accumulation and resultant mechanical behavior of Sn-Ag based solder joints.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr47.html#LeeS07}, volume = 47, year = 2007 }