%0 Conference Paper %1 conf/nems/MengZGCJ16 %A Meng, Wei %A Zeng, Qinghua %A Guan, Yong %A Chen, Jing %A Jin, Yufeng %B NEMS %D 2016 %I IEEE %K dblp %P 384-387 %T Thermal-mechanical reliability analysis of connection structure between redistribution layer and TSV for MEMS packaging. %U http://dblp.uni-trier.de/db/conf/nems/nems2016.html#MengZGCJ16 %@ 978-1-5090-1947-2

@inproceedings{conf/nems/MengZGCJ16, added-at = {2021-08-05T00:00:00.000+0200}, author = {Meng, Wei and Zeng, Qinghua and Guan, Yong and Chen, Jing and Jin, Yufeng}, biburl = {https://www.bibsonomy.org/bibtex/2bd4562fb8bd2f39045fcf24f55b3c73b/dblp}, booktitle = {NEMS}, crossref = {conf/nems/2016}, ee = {https://doi.org/10.1109/NEMS.2016.7758273}, interhash = {214f5b87984baef9ca79d99855e1164a}, intrahash = {bd4562fb8bd2f39045fcf24f55b3c73b}, isbn = {978-1-5090-1947-2}, keywords = {dblp}, pages = {384-387}, publisher = {IEEE}, timestamp = {2024-04-09T19:16:28.000+0200}, title = {Thermal-mechanical reliability analysis of connection structure between redistribution layer and TSV for MEMS packaging.}, url = {http://dblp.uni-trier.de/db/conf/nems/nems2016.html#MengZGCJ16}, year = 2016 }