%0 Journal Article %1 journals/mr/GuoSZCL18 %A Guo, Qiang %A Sun, Siyu %A Zhang, Zhihao %A Chen, Hongtao %A Li, Mingyu %D 2018 %J Microelectron. Reliab. %K dblp %P 144-148 %T Microstructure evolution and mechanical strength evaluation in Ag/Sn/Cu TLP bonding interconnection during aging test. %U http://dblp.uni-trier.de/db/journals/mr/mr80.html#GuoSZCL18 %V 80

@article{journals/mr/GuoSZCL18, added-at = {2023-09-30T00:00:00.000+0200}, author = {Guo, Qiang and Sun, Siyu and Zhang, Zhihao and Chen, Hongtao and Li, Mingyu}, biburl = {https://www.bibsonomy.org/bibtex/24d826086924ae0387c8737d6ae0e0b60/dblp}, ee = {https://doi.org/10.1016/j.microrel.2017.12.001}, interhash = {2fb538ae6e128ee43044b27f6b41ea74}, intrahash = {4d826086924ae0387c8737d6ae0e0b60}, journal = {Microelectron. Reliab.}, keywords = {dblp}, pages = {144-148}, timestamp = {2024-04-09T02:48:44.000+0200}, title = {Microstructure evolution and mechanical strength evaluation in Ag/Sn/Cu TLP bonding interconnection during aging test.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr80.html#GuoSZCL18}, volume = 80, year = 2018 }