%0 Journal Article %1 journals/mr/TsaiCLH06 %A Tsai, Ming-Yi %A Chiang, W. C. %A Liu, T. M. %A Hsu, G. H. %D 2006 %J Microelectron. Reliab. %K dblp %N 2-4 %P 476-486 %T Thermal deformation measurements and predictions of MAP-BGA electronic packages. %U http://dblp.uni-trier.de/db/journals/mr/mr46.html#TsaiCLH06 %V 46

@article{journals/mr/TsaiCLH06, added-at = {2024-05-02T00:00:00.000+0200}, author = {Tsai, Ming-Yi and Chiang, W. C. and Liu, T. M. and Hsu, G. H.}, biburl = {https://www.bibsonomy.org/bibtex/2610cf2c0360508953e79bcc6d7cda7ae/dblp}, ee = {https://doi.org/10.1016/j.microrel.2005.02.014}, interhash = {36b7372c490cb1715d0ee295ff1d3dd9}, intrahash = {610cf2c0360508953e79bcc6d7cda7ae}, journal = {Microelectron. Reliab.}, keywords = {dblp}, number = {2-4}, pages = {476-486}, timestamp = {2024-05-06T07:12:05.000+0200}, title = {Thermal deformation measurements and predictions of MAP-BGA electronic packages.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr46.html#TsaiCLH06}, volume = 46, year = 2006 }