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%0 Conference Paper
%1 conf/ets/Rodriguez-MontanesAF14
%A Rodríguez-Montañés, Rosa
%A Arumí, Daniel
%A Figueras, Joan
%B ETS
%D 2014
%E Natale, Giorgio Di
%I IEEE
%K dblp
%P 1-6
%T Post-bond test of Through-Silicon Vias with open defects.
%U http://dblp.uni-trier.de/db/conf/ets/ets2014.html#Rodriguez-MontanesAF14
%@ 978-1-4799-3415-7
@inproceedings{conf/ets/Rodriguez-MontanesAF14,
added-at = {2019-10-19T00:00:00.000+0200},
author = {Rodríguez-Montañés, Rosa and Arumí, Daniel and Figueras, Joan},
biburl = {https://www.bibsonomy.org/bibtex/22c09e6d7d77fbf5de9e6514dce53b58c/dblp},
booktitle = {ETS},
crossref = {conf/ets/2014},
editor = {Natale, Giorgio Di},
ee = {https://doi.org/10.1109/ETS.2014.6847816},
interhash = {3e75179656b33d5825f53e465c39891d},
intrahash = {2c09e6d7d77fbf5de9e6514dce53b58c},
isbn = {978-1-4799-3415-7},
keywords = {dblp},
pages = {1-6},
publisher = {IEEE},
timestamp = {2019-10-22T15:56:57.000+0200},
title = {Post-bond test of Through-Silicon Vias with open defects.},
url = {http://dblp.uni-trier.de/db/conf/ets/ets2014.html#Rodriguez-MontanesAF14},
year = 2014
}