%0 Journal Article %1 journals/tie/DingWSY23 %A Ding, Yi %A Wang, Yalin %A Sun, Hao %A Yin, Yi %D 2023 %J IEEE Trans. Ind. Electron. %K dblp %N 7 %P 7334-7342 %T High-Temperature Partial Discharge Characteristics of Power Module Packaging Insulation Under Square Pulse With High Dv/Dt Based on Down-Mixing Method. %U http://dblp.uni-trier.de/db/journals/tie/tie70.html#DingWSY23 %V 70

@article{journals/tie/DingWSY23, added-at = {2023-03-15T00:00:00.000+0100}, author = {Ding, Yi and Wang, Yalin and Sun, Hao and Yin, Yi}, biburl = {https://www.bibsonomy.org/bibtex/2e526d7b0d9d38430110e02ab5be7b0de/dblp}, ee = {https://doi.org/10.1109/TIE.2022.3201276}, interhash = {51444536c0546a0cdf2e9cea26dce5b5}, intrahash = {e526d7b0d9d38430110e02ab5be7b0de}, journal = {IEEE Trans. Ind. Electron.}, keywords = {dblp}, month = {July}, number = 7, pages = {7334-7342}, timestamp = {2024-04-08T10:32:48.000+0200}, title = {High-Temperature Partial Discharge Characteristics of Power Module Packaging Insulation Under Square Pulse With High Dv/Dt Based on Down-Mixing Method.}, url = {http://dblp.uni-trier.de/db/journals/tie/tie70.html#DingWSY23}, volume = 70, year = 2023 }