%0 Conference Paper %1 conf/vlsit/HuangHLCWCKL23 %A Huang, Yao-Hung %A Hsieh, Yu-Cheng %A Lin, Yu-Cheng %A Chih, Yue-Der %A Wang, Eric %A Chang, Jonathan %A King, Ya-Chin %A Lin, Chrong Jung %B VLSI Technology and Circuits %D 2023 %I IEEE %K dblp %P 1-2 %T High Density Embedded 3D Stackable Via RRAM in Advanced MCU Applications. %U http://dblp.uni-trier.de/db/conf/vlsit/vlsit2023.html#HuangHLCWCKL23 %@ 978-4-86348-806-9

@inproceedings{conf/vlsit/HuangHLCWCKL23, added-at = {2023-07-28T00:00:00.000+0200}, author = {Huang, Yao-Hung and Hsieh, Yu-Cheng and Lin, Yu-Cheng and Chih, Yue-Der and Wang, Eric and Chang, Jonathan and King, Ya-Chin and Lin, Chrong Jung}, biburl = {https://www.bibsonomy.org/bibtex/24a0bac141fc1377a352c9b0d84ebe7df/dblp}, booktitle = {VLSI Technology and Circuits}, crossref = {conf/vlsit/2023}, ee = {https://doi.org/10.23919/VLSITechnologyandCir57934.2023.10185230}, interhash = {514af1461e85cc055a933929c4b6efd8}, intrahash = {4a0bac141fc1377a352c9b0d84ebe7df}, isbn = {978-4-86348-806-9}, keywords = {dblp}, pages = {1-2}, publisher = {IEEE}, timestamp = {2024-04-09T19:13:01.000+0200}, title = {High Density Embedded 3D Stackable Via RRAM in Advanced MCU Applications.}, url = {http://dblp.uni-trier.de/db/conf/vlsit/vlsit2023.html#HuangHLCWCKL23}, year = 2023 }