%0 Conference Paper %1 conf/date/KahngKKSX19 %A Kahng, Andrew B. %A Kang, Seokhyeong %A Kim, Seungwon %A Samadi, Kambiz %A Xu, Bangqi %B DATE %D 2019 %E Teich, Jürgen %E Fummi, Franco %I IEEE %K dblp %P 842-847 %T Power Delivery Pathfinding for Emerging Die-to-Wafer Integration Technology. %U http://dblp.uni-trier.de/db/conf/date/date2019.html#KahngKKSX19 %@ 978-3-9819263-2-3

@inproceedings{conf/date/KahngKKSX19, added-at = {2019-05-20T00:00:00.000+0200}, author = {Kahng, Andrew B. and Kang, Seokhyeong and Kim, Seungwon and Samadi, Kambiz and Xu, Bangqi}, biburl = {https://www.bibsonomy.org/bibtex/268ae4dbbc5325e736c7d3dbaf8b7c127/dblp}, booktitle = {DATE}, crossref = {conf/date/2019}, editor = {Teich, Jürgen and Fummi, Franco}, ee = {https://doi.org/10.23919/DATE.2019.8715046}, interhash = {52a9caacc5384cb10bf63cb8c0668910}, intrahash = {68ae4dbbc5325e736c7d3dbaf8b7c127}, isbn = {978-3-9819263-2-3}, keywords = {dblp}, pages = {842-847}, publisher = {IEEE}, timestamp = {2019-10-17T15:00:29.000+0200}, title = {Power Delivery Pathfinding for Emerging Die-to-Wafer Integration Technology.}, url = {http://dblp.uni-trier.de/db/conf/date/date2019.html#KahngKKSX19}, year = 2019 }