%0 Journal Article %1 journals/tvlsi/ZhouZCPZZ18 %A Zhou, Hao %A Zhu, Hengliang %A Cui, Tao %A Pan, David Z. %A Zhou, Dian %A Zeng, Xuan %D 2018 %J IEEE Trans. Very Large Scale Integr. Syst. %K dblp %N 7 %P 1312-1325 %T Thermal Stress and Reliability Analysis of TSV-Based 3-D ICs With a Novel Adaptive Strategy Finite Element Method. %U http://dblp.uni-trier.de/db/journals/tvlsi/tvlsi26.html#ZhouZCPZZ18 %V 26

@article{journals/tvlsi/ZhouZCPZZ18, added-at = {2020-03-11T00:00:00.000+0100}, author = {Zhou, Hao and Zhu, Hengliang and Cui, Tao and Pan, David Z. and Zhou, Dian and Zeng, Xuan}, biburl = {https://www.bibsonomy.org/bibtex/2f0b1ed423763b8493f9e6e33eacb1256/dblp}, ee = {http://doi.ieeecomputersociety.org/10.1109/TVLSI.2018.2811417}, interhash = {54307e2a702c3c8e942cad3fb308636e}, intrahash = {f0b1ed423763b8493f9e6e33eacb1256}, journal = {IEEE Trans. Very Large Scale Integr. Syst.}, keywords = {dblp}, number = 7, pages = {1312-1325}, timestamp = {2020-03-12T11:44:02.000+0100}, title = {Thermal Stress and Reliability Analysis of TSV-Based 3-D ICs With a Novel Adaptive Strategy Finite Element Method.}, url = {http://dblp.uni-trier.de/db/journals/tvlsi/tvlsi26.html#ZhouZCPZZ18}, volume = 26, year = 2018 }