%0 Journal Article %1 journals/mr/SunGCLW18 %A Sun, Siyu %A Guo, Qiang %A Chen, Hongtao %A Li, Mingyu %A Wang, Chunqing %D 2018 %J Microelectron. Reliab. %K dblp %P 198-204 %T Solderless bonding with nanoporous copper as interlayer for high-temperature applications. %U http://dblp.uni-trier.de/db/journals/mr/mr80.html#SunGCLW18 %V 80

@article{journals/mr/SunGCLW18, added-at = {2020-02-22T00:00:00.000+0100}, author = {Sun, Siyu and Guo, Qiang and Chen, Hongtao and Li, Mingyu and Wang, Chunqing}, biburl = {https://www.bibsonomy.org/bibtex/2d3ea82f87bba9597448a1c29de7db71f/dblp}, ee = {https://www.wikidata.org/entity/Q57533781}, interhash = {605398cd2ad5e0ebe558f7fd629ddecb}, intrahash = {d3ea82f87bba9597448a1c29de7db71f}, journal = {Microelectron. Reliab.}, keywords = {dblp}, pages = {198-204}, timestamp = {2020-02-25T13:22:34.000+0100}, title = {Solderless bonding with nanoporous copper as interlayer for high-temperature applications.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr80.html#SunGCLW18}, volume = 80, year = 2018 }