%0 Journal Article %1 journals/ijrat/CuiYTZ14 %A Cui, Liangyu %A Yang, Chengjuan %A Tian, Yanling %A Zhang, Dawei %D 2014 %J Int. J. Robotics Appl. Technol. %K dblp %N 1 %P 1-18 %T Development and Application of Molded Interconnect Devices. %U http://dblp.uni-trier.de/db/journals/ijrat/ijrat2.html#CuiYTZ14 %V 2

@article{journals/ijrat/CuiYTZ14, added-at = {2020-08-07T00:00:00.000+0200}, author = {Cui, Liangyu and Yang, Chengjuan and Tian, Yanling and Zhang, Dawei}, biburl = {https://www.bibsonomy.org/bibtex/29509b6c0ecb722c36156afa2e1e179f2/dblp}, ee = {https://doi.org/10.4018/ijrat.2014010101}, interhash = {63ca064f6a51209d79d4b434118e110d}, intrahash = {9509b6c0ecb722c36156afa2e1e179f2}, journal = {Int. J. Robotics Appl. Technol.}, keywords = {dblp}, number = 1, pages = {1-18}, timestamp = {2020-08-08T11:43:51.000+0200}, title = {Development and Application of Molded Interconnect Devices.}, url = {http://dblp.uni-trier.de/db/journals/ijrat/ijrat2.html#CuiYTZ14}, volume = 2, year = 2014 }