Article,
3D Chip Stack Technology Using Through-Chip Interconnects.
P. Benkart, A. Kaiser, A. Munding, M. Bschorr, H. Pfleiderer, E. Kohn, A. Heittmann, H. Huebner, and U. Ramacher.IEEE Des. Test Comput., 22 (6): 512-518 (2005)
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- 2005
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- IEEE Des. Test Comput.
- number
- 6
- pages
- 512-518
- volume
- 22
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- http://doi.ieeecomputersociety.org/10.1109/MDT.2005.125
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%1 journals/dt/BenkartKMBPKHHR05
%A Benkart, Peter
%A Kaiser, Alexander
%A Munding, Andreas
%A Bschorr, Markus
%A Pfleiderer, Hans-Jörg
%A Kohn, Erhard
%A Heittmann, Arne
%A Huebner, Holger
%A Ramacher, Ulrich
%D 2005
%J IEEE Des. Test Comput.
%K dblp
%N 6
%P 512-518
%T 3D Chip Stack Technology Using Through-Chip Interconnects.
%U http://dblp.uni-trier.de/db/journals/dt/dt22.html#BenkartKMBPKHHR05
%V 22
@article{journals/dt/BenkartKMBPKHHR05,
added-at = {2020-10-26T00:00:00.000+0100},
author = {Benkart, Peter and Kaiser, Alexander and Munding, Andreas and Bschorr, Markus and Pfleiderer, Hans-Jörg and Kohn, Erhard and Heittmann, Arne and Huebner, Holger and Ramacher, Ulrich},
biburl = {https://www.bibsonomy.org/bibtex/237f87266984867820841959175b1af62/dblp},
ee = {http://doi.ieeecomputersociety.org/10.1109/MDT.2005.125},
interhash = {6bbf54955f4cec6f40bf76cf1e266c8e},
intrahash = {37f87266984867820841959175b1af62},
journal = {IEEE Des. Test Comput.},
keywords = {dblp},
number = 6,
pages = {512-518},
timestamp = {2020-10-27T12:50:21.000+0100},
title = {3D Chip Stack Technology Using Through-Chip Interconnects.},
url = {http://dblp.uni-trier.de/db/journals/dt/dt22.html#BenkartKMBPKHHR05},
volume = 22,
year = 2005
}