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%0 Journal Article
%1 journals/mr/TsukamotoNSMSN11
%A Tsukamoto, H.
%A Nishimura, T.
%A Suenaga, S.
%A McDonald, Stuart D.
%A Sweatman, Keith W.
%A Nogita, Kazuhiro
%D 2011
%J Microelectron. Reliab.
%K dblp
%N 3
%P 657-667
%T The influence of solder composition on the impact strength of lead-free solder ball grid array joints.
%U http://dblp.uni-trier.de/db/journals/mr/mr51.html#TsukamotoNSMSN11
%V 51
@article{journals/mr/TsukamotoNSMSN11,
added-at = {2020-02-22T00:00:00.000+0100},
author = {Tsukamoto, H. and Nishimura, T. and Suenaga, S. and McDonald, Stuart D. and Sweatman, Keith W. and Nogita, Kazuhiro},
biburl = {https://www.bibsonomy.org/bibtex/2412bbed832bdd740c0b680fac2fda4a5/dblp},
ee = {https://doi.org/10.1016/j.microrel.2010.10.012},
interhash = {9cb1bf21c06692557ad3b62ecd27b6fd},
intrahash = {412bbed832bdd740c0b680fac2fda4a5},
journal = {Microelectron. Reliab.},
keywords = {dblp},
number = 3,
pages = {657-667},
timestamp = {2020-02-25T13:27:55.000+0100},
title = {The influence of solder composition on the impact strength of lead-free solder ball grid array joints.},
url = {http://dblp.uni-trier.de/db/journals/mr/mr51.html#TsukamotoNSMSN11},
volume = 51,
year = 2011
}