%0 Journal Article %1 journals/mr/TsaiHLWH15 %A Tsai, Ming-Yi %A Huang, P. S. %A Lin, C. H. %A Wu, C. T. %A Hu, S. C. %D 2015 %J Microelectron. Reliab. %K dblp %N 12 %P 2589-2595 %T Mechanical design and analysis of direct-plated-copper aluminum nitride substrates for enhancing thermal reliability. %U http://dblp.uni-trier.de/db/journals/mr/mr55.html#TsaiHLWH15 %V 55

@article{journals/mr/TsaiHLWH15, added-at = {2024-04-20T00:00:00.000+0200}, author = {Tsai, Ming-Yi and Huang, P. S. and Lin, C. H. and Wu, C. T. and Hu, S. C.}, biburl = {https://www.bibsonomy.org/bibtex/24eac9ad336cf615b4d3673d7ea5e417f/dblp}, ee = {https://doi.org/10.1016/j.microrel.2015.08.010}, interhash = {a2d20d0ef5091932d8fde8ef5a751e98}, intrahash = {4eac9ad336cf615b4d3673d7ea5e417f}, journal = {Microelectron. Reliab.}, keywords = {dblp}, number = 12, pages = {2589-2595}, timestamp = {2024-04-22T07:11:35.000+0200}, title = {Mechanical design and analysis of direct-plated-copper aluminum nitride substrates for enhancing thermal reliability.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr55.html#TsaiHLWH15}, volume = 55, year = 2015 }