Inproceedings,
Glass Molded Optical Interposers for Wafer Scale Datacom Component Packaging.
F. Merget, M. Ackermann, B. Shen, G. Saunders, S. Haag, M. Wolz, and J. Witzens.ECOC, page 1-4. IEEE, (2021)
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- BibTeX key
- conf/ecoc/MergetASSHWW21
- entry type
- inproceedings
- booktitle
- ECOC
- year
- 2021
- pages
- 1-4
- publisher
- IEEE
- crossref
- conf/ecoc/2021
- ee
- https://doi.org/10.1109/ECOC52684.2021.9605906
- isbn
- 978-1-6654-3868-1
- url
- http://dblp.uni-trier.de/db/conf/ecoc/ecoc2021.html#MergetASSHWW21
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- please select -%0 Conference Paper
%1 conf/ecoc/MergetASSHWW21
%A Merget, Florian
%A Ackermann, Manuel
%A Shen, Bin
%A Saunders, Gordon Davis
%A Haag, Sebastian
%A Wolz, Michael
%A Witzens, Jeremy
%B ECOC
%D 2021
%I IEEE
%K dblp
%P 1-4
%T Glass Molded Optical Interposers for Wafer Scale Datacom Component Packaging.
%U http://dblp.uni-trier.de/db/conf/ecoc/ecoc2021.html#MergetASSHWW21
%@ 978-1-6654-3868-1
@inproceedings{conf/ecoc/MergetASSHWW21,
added-at = {2023-05-31T00:00:00.000+0200},
author = {Merget, Florian and Ackermann, Manuel and Shen, Bin and Saunders, Gordon Davis and Haag, Sebastian and Wolz, Michael and Witzens, Jeremy},
biburl = {https://www.bibsonomy.org/bibtex/24126fc75af2690ae86bd86d2a5502ae3/dblp},
booktitle = {ECOC},
crossref = {conf/ecoc/2021},
ee = {https://doi.org/10.1109/ECOC52684.2021.9605906},
interhash = {aaa85acdbb19510e47add10ae3efb025},
intrahash = {4126fc75af2690ae86bd86d2a5502ae3},
isbn = {978-1-6654-3868-1},
keywords = {dblp},
pages = {1-4},
publisher = {IEEE},
timestamp = {2024-04-10T02:35:34.000+0200},
title = {Glass Molded Optical Interposers for Wafer Scale Datacom Component Packaging.},
url = {http://dblp.uni-trier.de/db/conf/ecoc/ecoc2021.html#MergetASSHWW21},
year = 2021
}