%0 Journal Article %1 journals/mr/LinWWZ16 %A Lin, Lin %A Wang, Jun %A Wang, Lei %A Zhang, Wenqi %D 2016 %J Microelectron. Reliab. %K dblp %P 198-204 %T The stress analysis and parametric studies for the low-k layers of a chip in the flip-chip process. %U http://dblp.uni-trier.de/db/journals/mr/mr65.html#LinWWZ16 %V 65

@article{journals/mr/LinWWZ16, added-at = {2020-02-22T00:00:00.000+0100}, author = {Lin, Lin and Wang, Jun and Wang, Lei and Zhang, Wenqi}, biburl = {https://www.bibsonomy.org/bibtex/272e478227012d1f0a3b8abcb2d815e33/dblp}, ee = {https://doi.org/10.1016/j.microrel.2016.09.001}, interhash = {ab293827a26d004e0c0b6aff9cacc06d}, intrahash = {72e478227012d1f0a3b8abcb2d815e33}, journal = {Microelectron. Reliab.}, keywords = {dblp}, pages = {198-204}, timestamp = {2020-02-25T13:24:01.000+0100}, title = {The stress analysis and parametric studies for the low-k layers of a chip in the flip-chip process.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr65.html#LinWWZ16}, volume = 65, year = 2016 }