%0 Conference Paper %1 conf/icta3/YuK22 %A Yu, Haiyang %A Kao, C. R. %B ICTA %D 2022 %I IEEE %K dblp %P 20-21 %T Formation Mechanism of high Ni content (Cu, Ni)6Sn5 in Cu/Sn/Ni microbump for solid state aging. %U http://dblp.uni-trier.de/db/conf/icta3/icta2022.html#YuK22 %@ 978-1-6654-9269-0

@inproceedings{conf/icta3/YuK22, added-at = {2023-11-16T00:00:00.000+0100}, author = {Yu, Haiyang and Kao, C. R.}, biburl = {https://www.bibsonomy.org/bibtex/27bfb91944c5f7d2eb66bd6f3e7362561/dblp}, booktitle = {ICTA}, crossref = {conf/icta3/2022}, ee = {https://doi.org/10.1109/ICTA56932.2022.9962977}, interhash = {ae4524e16ea3be02ca3a3b8a8f02caf8}, intrahash = {7bfb91944c5f7d2eb66bd6f3e7362561}, isbn = {978-1-6654-9269-0}, keywords = {dblp}, pages = {20-21}, publisher = {IEEE}, timestamp = {2024-04-09T17:04:10.000+0200}, title = {Formation Mechanism of high Ni content (Cu, Ni)6Sn5 in Cu/Sn/Ni microbump for solid state aging.}, url = {http://dblp.uni-trier.de/db/conf/icta3/icta2022.html#YuK22}, year = 2022 }