%0 Conference Paper %1 conf/3dic/SugaHYL15 %A Suga, Daisuke %A Hashizume, Masaki %A Yotsuyanagi, Hiroyuki %A Lu, Shyue-Kung %B 3DIC %D 2015 %I IEEE %K dblp %P TS8.19.1-TS8.19.6 %T Electrical interconnect test method of 3D ICs by injected charge volume. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2015.html#SugaHYL15 %@ 978-1-4673-9385-0

@inproceedings{conf/3dic/SugaHYL15, added-at = {2017-05-21T00:00:00.000+0200}, author = {Suga, Daisuke and Hashizume, Masaki and Yotsuyanagi, Hiroyuki and Lu, Shyue-Kung}, biburl = {https://www.bibsonomy.org/bibtex/2806fe1b62f0b08ba9cfc978c8efa90cb/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2015}, ee = {https://doi.org/10.1109/3DIC.2015.7334588}, interhash = {c07c330574710cf42e28a3a76e6a3c6c}, intrahash = {806fe1b62f0b08ba9cfc978c8efa90cb}, isbn = {978-1-4673-9385-0}, keywords = {dblp}, pages = {TS8.19.1-TS8.19.6}, publisher = {IEEE}, timestamp = {2019-10-17T15:31:37.000+0200}, title = {Electrical interconnect test method of 3D ICs by injected charge volume.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2015.html#SugaHYL15}, year = 2015 }