%0 Journal Article %1 journals/tcad/HuangHTC14 %A Huang, Li-Ren %A Huang, Shi-Yu %A Tsai, Kun-Han %A Cheng, Wu-Tung %D 2014 %J IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. %K dblp %N 3 %P 476-488 %T Parametric Fault Testing and Performance Characterization of Post-Bond Interposer Wires in 2.5-D ICs. %U http://dblp.uni-trier.de/db/journals/tcad/tcad33.html#HuangHTC14 %V 33

@article{journals/tcad/HuangHTC14, added-at = {2020-09-24T00:00:00.000+0200}, author = {Huang, Li-Ren and Huang, Shi-Yu and Tsai, Kun-Han and Cheng, Wu-Tung}, biburl = {https://www.bibsonomy.org/bibtex/26bd126b443b8ccfb020b60a8e8a606bc/dblp}, ee = {https://doi.org/10.1109/TCAD.2013.2290589}, interhash = {d2d78a304d99b9ff1d20e1382de50d7a}, intrahash = {6bd126b443b8ccfb020b60a8e8a606bc}, journal = {IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.}, keywords = {dblp}, number = 3, pages = {476-488}, timestamp = {2020-09-25T11:45:41.000+0200}, title = {Parametric Fault Testing and Performance Characterization of Post-Bond Interposer Wires in 2.5-D ICs.}, url = {http://dblp.uni-trier.de/db/journals/tcad/tcad33.html#HuangHTC14}, volume = 33, year = 2014 }