%0 Conference Paper %1 conf/iscas/YinCKG15 %A Yin, Liang %A Chen, Cheng-Po %A Kapusta, Christopher %A Ghandi, Reza %B ISCAS %D 2015 %I IEEE %K dblp %P 1170-1173 %T Electronic packaging of SiC MOSFET-based devices for reliable high temperature operation. %U http://dblp.uni-trier.de/db/conf/iscas/iscas2015.html#YinCKG15 %@ 978-1-4799-8391-9

@inproceedings{conf/iscas/YinCKG15, added-at = {2015-08-05T00:00:00.000+0200}, author = {Yin, Liang and Chen, Cheng-Po and Kapusta, Christopher and Ghandi, Reza}, biburl = {https://www.bibsonomy.org/bibtex/21bdae44a3ae5b8d16bdc9ab51ddf5105/dblp}, booktitle = {ISCAS}, crossref = {conf/iscas/2015}, ee = {http://dx.doi.org/10.1109/ISCAS.2015.7168847}, interhash = {d2d95486fa5c6bfa89e815cf03ee95fc}, intrahash = {1bdae44a3ae5b8d16bdc9ab51ddf5105}, isbn = {978-1-4799-8391-9}, keywords = {dblp}, pages = {1170-1173}, publisher = {IEEE}, timestamp = {2015-08-06T11:33:45.000+0200}, title = {Electronic packaging of SiC MOSFET-based devices for reliable high temperature operation.}, url = {http://dblp.uni-trier.de/db/conf/iscas/iscas2015.html#YinCKG15}, year = 2015 }