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- BibTeX key
- conf/biostec/JeongKKPKJ11
- entry type
- inproceedings
- booktitle
- BIODEVICES
- year
- 2011
- pages
- 311-314
- publisher
- SciTePress
- crossref
- conf/biostec/2011bd
- isbn
- 978-989-8425-37-9
- url
- http://dblp.uni-trier.de/db/conf/biostec/biodevices2011.html#JeongKKPKJ11
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- please select -%0 Conference Paper
%1 conf/biostec/JeongKKPKJ11
%A Jeong, Myeong-Hyeok
%A Kim, Jae-Won
%A Kwak, Byung-Hyun
%A Park, Young-Bae
%A Kim, Byoung-Joon
%A Joo, Young-Chang
%B BIODEVICES
%D 2011
%E Vieira, Pedro
%E Fred, Ana L. N.
%E Filipe, Joaquim
%E Gamboa, Hugo
%I SciTePress
%K dblp
%P 311-314
%T Electrical Reliability of Cu/Sn Micro-bump in Wafer Level Packaging for BioMEMS Devices.
%U http://dblp.uni-trier.de/db/conf/biostec/biodevices2011.html#JeongKKPKJ11
%@ 978-989-8425-37-9
@inproceedings{conf/biostec/JeongKKPKJ11,
added-at = {2013-02-28T00:00:00.000+0100},
author = {Jeong, Myeong-Hyeok and Kim, Jae-Won and Kwak, Byung-Hyun and Park, Young-Bae and Kim, Byoung-Joon and Joo, Young-Chang},
biburl = {https://www.bibsonomy.org/bibtex/2f73fe8eedad8cb68a3814f327ecf5062/dblp},
booktitle = {BIODEVICES},
crossref = {conf/biostec/2011bd},
editor = {Vieira, Pedro and Fred, Ana L. N. and Filipe, Joaquim and Gamboa, Hugo},
interhash = {dc53a7a387bbf3a2580430cf2bf8f89a},
intrahash = {f73fe8eedad8cb68a3814f327ecf5062},
isbn = {978-989-8425-37-9},
keywords = {dblp},
pages = {311-314},
publisher = {SciTePress},
timestamp = {2017-06-21T11:39:24.000+0200},
title = {Electrical Reliability of Cu/Sn Micro-bump in Wafer Level Packaging for BioMEMS Devices.},
url = {http://dblp.uni-trier.de/db/conf/biostec/biodevices2011.html#JeongKKPKJ11},
year = 2011
}