%0 Journal Article %1 journals/dt/DasSC20 %A Das, Sourav %A Su, Fei %A Chakravarty, Sreejit %D 2020 %J IEEE Des. Test %K dblp %N 4 %P 27-34 %T Testing of Prebond Through Silicon Vias. %U http://dblp.uni-trier.de/db/journals/dt/dt37.html#DasSC20 %V 37

@article{journals/dt/DasSC20, added-at = {2020-09-19T00:00:00.000+0200}, author = {Das, Sourav and Su, Fei and Chakravarty, Sreejit}, biburl = {https://www.bibsonomy.org/bibtex/25566958697228d0081e1c0c46c3e14f2/dblp}, ee = {https://doi.org/10.1109/MDAT.2020.2968255}, interhash = {eaaa0ca24f88c96bd1e2141ebc84b440}, intrahash = {5566958697228d0081e1c0c46c3e14f2}, journal = {IEEE Des. Test}, keywords = {dblp}, number = 4, pages = {27-34}, timestamp = {2020-09-20T11:37:30.000+0200}, title = {Testing of Prebond Through Silicon Vias.}, url = {http://dblp.uni-trier.de/db/journals/dt/dt37.html#DasSC20}, volume = 37, year = 2020 }