%0 Journal Article %1 journals/mr/LeeKHKLK18 %A Lee, Hyunju %A Kim, Cheolmin %A Heo, Cheolho %A Kim, Chiho %A Lee, Jae-Ho %A Kim, Yangdo %D 2018 %J Microelectron. Reliab. %K dblp %P 75-80 %T Effect of solder resist dissolution on the joint reliability of ENIG surface and Sn-Ag-Cu solder. %U http://dblp.uni-trier.de/db/journals/mr/mr87.html#LeeKHKLK18 %V 87

@article{journals/mr/LeeKHKLK18, added-at = {2022-10-02T00:00:00.000+0200}, author = {Lee, Hyunju and Kim, Cheolmin and Heo, Cheolho and Kim, Chiho and Lee, Jae-Ho and Kim, Yangdo}, biburl = {https://www.bibsonomy.org/bibtex/216d2dbae2ebadcf4a3191659afdddbb1/dblp}, ee = {https://doi.org/10.1016/j.microrel.2018.05.017}, interhash = {eb3f299d0ac1bd0e1ca3bc3b5b85ed1d}, intrahash = {16d2dbae2ebadcf4a3191659afdddbb1}, journal = {Microelectron. Reliab.}, keywords = {dblp}, pages = {75-80}, timestamp = {2024-04-09T02:49:51.000+0200}, title = {Effect of solder resist dissolution on the joint reliability of ENIG surface and Sn-Ag-Cu solder.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr87.html#LeeKHKLK18}, volume = 87, year = 2018 }