%0 Journal Article %1 journals/mr/HuLLLM14 %A Hu, Xiaowu %A Li, Yulong %A Liu, Yong %A Liu, Yi %A Min, Zhixian %D 2014 %J Microelectron. Reliab. %K dblp %N 8 %P 1575-1582 %T Microstructure and shear strength of Sn37Pb/Cu solder joints subjected to isothermal aging. %U http://dblp.uni-trier.de/db/journals/mr/mr54.html#HuLLLM14 %V 54

@article{journals/mr/HuLLLM14, added-at = {2020-02-22T00:00:00.000+0100}, author = {Hu, Xiaowu and Li, Yulong and Liu, Yong and Liu, Yi and Min, Zhixian}, biburl = {https://www.bibsonomy.org/bibtex/20301f868edde04b5bf89482c7e391227/dblp}, ee = {https://doi.org/10.1016/j.microrel.2014.04.003}, interhash = {f674d9940d5df262500ef7fab0529970}, intrahash = {0301f868edde04b5bf89482c7e391227}, journal = {Microelectron. Reliab.}, keywords = {dblp}, number = 8, pages = {1575-1582}, timestamp = {2020-02-25T13:23:02.000+0100}, title = {Microstructure and shear strength of Sn37Pb/Cu solder joints subjected to isothermal aging.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr54.html#HuLLLM14}, volume = 54, year = 2014 }