%0 Journal Article %1 journals/tase/LiuTLT19 %A Liu, Dong %A Teo, Chek Sing %A Liang, Wenyu %A Tan, Kok Kiong %D 2019 %J IEEE Trans Autom. Sci. Eng. %K dblp %N 2 %P 668-677 %T Soft-Acting, Noncontact Gripping Method for Ultrathin Wafers Using Distributed Bernoulli Principle. %U http://dblp.uni-trier.de/db/journals/tase/tase16.html#LiuTLT19 %V 16

@article{journals/tase/LiuTLT19, added-at = {2020-04-02T00:00:00.000+0200}, author = {Liu, Dong and Teo, Chek Sing and Liang, Wenyu and Tan, Kok Kiong}, biburl = {https://www.bibsonomy.org/bibtex/20da58d867dbce4dd98b744c9138301a2/dblp}, ee = {https://doi.org/10.1109/TASE.2018.2848635}, interhash = {e54a43fad0fa0385871fba5a2039ef8e}, intrahash = {0da58d867dbce4dd98b744c9138301a2}, journal = {IEEE Trans Autom. Sci. Eng.}, keywords = {dblp}, number = 2, pages = {668-677}, timestamp = {2020-04-03T12:04:02.000+0200}, title = {Soft-Acting, Noncontact Gripping Method for Ultrathin Wafers Using Distributed Bernoulli Principle.}, url = {http://dblp.uni-trier.de/db/journals/tase/tase16.html#LiuTLT19}, volume = 16, year = 2019 }