Thermionic emission in heterostructures is proposed for integrated cooling of high power electronic and optoelectronic devices. This evaporative cooling is achieved by selective emission of hot electrons over a barrier layer from the cathode to the anode. It is shown that with available high electron mobility and low thermal conductivity materials, and with optimized conduction band offsets in heterostructures, single-stage room temperature cooling of up to 20°-40° over thicknesses of the order of microns is possible.
%0 Journal Article
%1 shakouri:1234
%A Shakouri, Ali
%A Bowers, John E.
%D 1997
%I AIP
%J Applied Physics Letters
%K cooling electron_mobility hot_carriers optoelectronic_devices thermal_conductivity thermionic_electron_emission thermoelectric_devices
%N 9
%P 1234-1236
%R 10.1063/1.119861
%T Heterostructure integrated thermionic coolers
%U http://link.aip.org/link/?APL/71/1234/1
%V 71
%X Thermionic emission in heterostructures is proposed for integrated cooling of high power electronic and optoelectronic devices. This evaporative cooling is achieved by selective emission of hot electrons over a barrier layer from the cathode to the anode. It is shown that with available high electron mobility and low thermal conductivity materials, and with optimized conduction band offsets in heterostructures, single-stage room temperature cooling of up to 20°-40° over thicknesses of the order of microns is possible.
@article{shakouri:1234,
abstract = {Thermionic emission in heterostructures is proposed for integrated cooling of high power electronic and optoelectronic devices. This evaporative cooling is achieved by selective emission of hot electrons over a barrier layer from the cathode to the anode. It is shown that with available high electron mobility and low thermal conductivity materials, and with optimized conduction band offsets in heterostructures, single-stage room temperature cooling of up to 20°-40° over thicknesses of the order of microns is possible.},
added-at = {2007-08-07T19:53:06.000+0200},
author = {Shakouri, Ali and Bowers, John E.},
biburl = {https://www.bibsonomy.org/bibtex/214eb752a3a18f730a7b6a9a8528fa1fb/essential.beatfinger},
description = {Heterostructure integrated thermionic coolers},
doi = {10.1063/1.119861},
interhash = {9263af812a04e10660fad8da693f42f6},
intrahash = {14eb752a3a18f730a7b6a9a8528fa1fb},
journal = {Applied Physics Letters},
keywords = {cooling electron_mobility hot_carriers optoelectronic_devices thermal_conductivity thermionic_electron_emission thermoelectric_devices},
number = 9,
pages = {1234-1236},
publisher = {AIP},
timestamp = {2007-08-07T19:53:06.000+0200},
title = {Heterostructure integrated thermionic coolers},
url = {http://link.aip.org/link/?APL/71/1234/1},
volume = 71,
year = 1997
}