%0 Journal Article %1 journals/mr/HuJSLCZ18 %A Hu, Jiaxing %A Jing, Bo %A Sheng, Zengjin %A Lu, Fang %A Chen, Yaojun %A Zhang, Yulin %D 2018 %J Microelectron. Reliab. %K dblp %P 120-127 %T Failure and failure characterization of QFP package interconnect structure under random vibration condition. %U http://dblp.uni-trier.de/db/journals/mr/mr91.html#HuJSLCZ18 %V 91

@article{journals/mr/HuJSLCZ18, added-at = {2020-02-22T00:00:00.000+0100}, author = {Hu, Jiaxing and Jing, Bo and Sheng, Zengjin and Lu, Fang and Chen, Yaojun and Zhang, Yulin}, biburl = {https://www.bibsonomy.org/bibtex/21c639ee7342c1beef9f98137f47f9829/dblp}, ee = {https://doi.org/10.1016/j.microrel.2018.08.011}, interhash = {5e0c28f0bd0ae8f2a4ea41cab5ba0084}, intrahash = {1c639ee7342c1beef9f98137f47f9829}, journal = {Microelectron. Reliab.}, keywords = {dblp}, pages = {120-127}, timestamp = {2020-02-25T13:25:08.000+0100}, title = {Failure and failure characterization of QFP package interconnect structure under random vibration condition.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr91.html#HuJSLCZ18}, volume = 91, year = 2018 }