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Disambiguation of "Tanaka, Shuji"

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Wafer-level vacuum packaging for hetero-integration by thermo-compression bonding using planarized-electroplated gold bumps.

, , and . NEMS, page 573-577. IEEE, (2016)

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Masao Tanaka

Masafumi Tanaka

Shuji Kimura

Shuji Sato

Shu Tanaka

 

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Deep Structures Wet Etched Into Lithium Niobate Using A Physical Mask., , , and . International Journal of Computational Engineering Science, 4 (3): 497-500 (2003)A 1.9GHz Low-Phase-Noise Complementary Cross-Coupled FBAR-VCO without Additional Voltage Headroom in 0.18µm CMOS Technology., , , , , , , and . IEICE Trans. Electron., 100-C (4): 363-369 (2017)Stacked Integration of MEMS on LSI., and . Micromachines, 7 (8): 137 (2016)Outgassing study of thin films used for poly-SiGe based vacuum packaging of MEMS., , , , , , , and . Microelectron. Reliab., 51 (9-11): 1878-1881 (2011)Lamb wave resonators and resonator filters in periodical poled Z-cut LiTaO3 plate., , , , and . NEMS, page 512-515. IEEE, (2016)Delay window blind oversampling clock and data recovery algorithm with wide tracking range., , , , and . ISCAS, page 1598-1601. IEEE, (2015)Development of a Real-Time Force and Temperature Sensing System with MEMS-LSI Integrated Tactile Sensors for Next-Generation Robots., , , and . J. Robotics Mechatronics, 32 (2): 323-332 (2020)Fabrication of a multilayer spiral coil by selective bonding, debonding and MEMS technologies., , , and . NEMS, page 401-404. IEEE, (2016)Electroplating of neodymium iron alloys., , , , and . NEMS, page 405-408. IEEE, (2016)A Tactile Sensor Network System Using a Multiple Sensor Platform with a Dedicated CMOS-LSI for Robot Applications., , , , , , and . Sensors, 17 (9): 1974 (2017)