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Outgassing study of thin films used for poly-SiGe based vacuum packaging of MEMS., , , , , , , and . Microelectron. Reliab., 51 (9-11): 1878-1881 (2011)Deep Structures Wet Etched Into Lithium Niobate Using A Physical Mask., , , and . International Journal of Computational Engineering Science, 4 (3): 497-500 (2003)A 1.9GHz Low-Phase-Noise Complementary Cross-Coupled FBAR-VCO without Additional Voltage Headroom in 0.18µm CMOS Technology., , , , , , , and . IEICE Trans. Electron., 100-C (4): 363-369 (2017)Stacked Integration of MEMS on LSI., and . Micromachines, 7 (8): 137 (2016)Delay window blind oversampling clock and data recovery algorithm with wide tracking range., , , , and . ISCAS, page 1598-1601. IEEE, (2015)Lamb wave resonators and resonator filters in periodical poled Z-cut LiTaO3 plate., , , , and . NEMS, page 512-515. IEEE, (2016)Electrical Design and Evaluation of Asynchronous Serial Bus Communication Network of 48 Sensor Platform LSIs with Single-Ended I/O for Integrated MEMS-LSI Sensors., , , , and . Sensors, 18 (1): 231 (2018)Multi-Ring Disk Resonator with Elliptic Spokes for Frequency-Modulated Gyroscope., , , and . Sensors, 23 (6): 2937 (March 2023)A1 mode Lamb wave on thin LiTaO3 for high frequency acoustic devices., , , and . NEMS, page 473-477. IEEE, (2016)Wafer-level vacuum packaging for hetero-integration by thermo-compression bonding using planarized-electroplated gold bumps., , and . NEMS, page 573-577. IEEE, (2016)