%0 Conference Paper %1 conf/3dic/LiXOBHHCK11 %A Li, H. Y. %A Xie, L. %A Ong, L. G. %A Baram, A. %A Herer, I. %A Hirshberg, Arnon %A Chong, S. C. %A Kwong, D. L. %B 3DIC %D 2011 %E Koyanagi, Mitsumasa %E Kada, Morihiro %I IEEE %K dblp %P 1-4 %T Ultra-compact micro-coil realized via multilevel dense TSV coil for MEMs application. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2011.html#LiXOBHHCK11 %@ 978-1-4673-2189-1

@inproceedings{conf/3dic/LiXOBHHCK11, added-at = {2017-05-21T00:00:00.000+0200}, author = {Li, H. Y. and Xie, L. and Ong, L. G. and Baram, A. and Herer, I. and Hirshberg, Arnon and Chong, S. C. and Kwong, D. L.}, biburl = {https://www.bibsonomy.org/bibtex/251150774ea6efe24958a802a4101c798/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2011}, editor = {Koyanagi, Mitsumasa and Kada, Morihiro}, ee = {https://doi.org/10.1109/3DIC.2012.6263008}, interhash = {05cd4f77ed682417060a0a19642822ec}, intrahash = {51150774ea6efe24958a802a4101c798}, isbn = {978-1-4673-2189-1}, keywords = {dblp}, pages = {1-4}, publisher = {IEEE}, timestamp = {2019-10-17T15:31:14.000+0200}, title = {Ultra-compact micro-coil realized via multilevel dense TSV coil for MEMs application.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2011.html#LiXOBHHCK11}, year = 2011 }