%0 Conference Paper %1 conf/3dic/FritzschMBTKWWR09 %A Fritzsch, Thomas %A Mrossko, Raul %A Baumgartner, Tobias %A Toepper, Michael %A Klein, Matthias %A Wolf, Jürgen %A Wunderle, Bernhard %A Reichl, Herbert %B 3DIC %D 2009 %I IEEE %K dblp %P 1-8 %T 3-D thin chip integration technology - from technology development to application. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2009.html#FritzschMBTKWWR09 %@ 978-1-4244-4512-7

@inproceedings{conf/3dic/FritzschMBTKWWR09, added-at = {2023-09-30T00:00:00.000+0200}, author = {Fritzsch, Thomas and Mrossko, Raul and Baumgartner, Tobias and Toepper, Michael and Klein, Matthias and Wolf, Jürgen and Wunderle, Bernhard and Reichl, Herbert}, biburl = {https://www.bibsonomy.org/bibtex/25af83927e83420b2a319c1cd418e14d6/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2009}, ee = {https://doi.org/10.1109/3DIC.2009.5306578}, interhash = {006ca53214f1e9a7e92c413d5b4af93e}, intrahash = {5af83927e83420b2a319c1cd418e14d6}, isbn = {978-1-4244-4512-7}, keywords = {dblp}, pages = {1-8}, publisher = {IEEE}, timestamp = {2024-04-10T12:10:49.000+0200}, title = {3-D thin chip integration technology - from technology development to application.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2009.html#FritzschMBTKWWR09}, year = 2009 }