%0 Conference Paper %1 conf/asicon/AoDCG11 %A Ao, Jianchang %A Dong, Sheqin %A Chen, Song %A Goto, Satoshi %B ASICON %D 2011 %I IEEE %K dblp %P 353-356 %T Through-Silicon-Via assignment for 3D ICs. %U http://dblp.uni-trier.de/db/conf/asicon/asicon2011.html#AoDCG11 %@ 978-1-61284-192-2

@inproceedings{conf/asicon/AoDCG11, added-at = {2018-08-30T00:00:00.000+0200}, author = {Ao, Jianchang and Dong, Sheqin and Chen, Song and Goto, Satoshi}, biburl = {https://www.bibsonomy.org/bibtex/2e61093d8824bdf9e63364e0ec457f67e/dblp}, booktitle = {ASICON}, crossref = {conf/asicon/2011}, ee = {https://doi.org/10.1109/ASICON.2011.6157194}, interhash = {12524fa3aa2e5cae59362cfabef9c6c7}, intrahash = {e61093d8824bdf9e63364e0ec457f67e}, isbn = {978-1-61284-192-2}, keywords = {dblp}, pages = {353-356}, publisher = {IEEE}, timestamp = {2018-08-31T11:41:07.000+0200}, title = {Through-Silicon-Via assignment for 3D ICs.}, url = {http://dblp.uni-trier.de/db/conf/asicon/asicon2011.html#AoDCG11}, year = 2011 }