%0 Journal Article %1 journals/tcad/ZhuoS23 %A Zhuo, Cheng %A Sun, Songyu %D 2023 %J IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. %K dblp %N 5 %P 1643-1647 %T A Fast Method to Estimate Through-Bump Current for Power Delivery Verification. %U http://dblp.uni-trier.de/db/journals/tcad/tcad42.html#ZhuoS23 %V 42

@article{journals/tcad/ZhuoS23, added-at = {2023-04-29T00:00:00.000+0200}, author = {Zhuo, Cheng and Sun, Songyu}, biburl = {https://www.bibsonomy.org/bibtex/2e9d6a364902f531b813ae1d73b26df98/dblp}, ee = {https://doi.org/10.1109/TCAD.2022.3203957}, interhash = {13dbf005542fd5c0b3c6c0c00704ec0a}, intrahash = {e9d6a364902f531b813ae1d73b26df98}, journal = {IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.}, keywords = {dblp}, month = May, number = 5, pages = {1643-1647}, timestamp = {2024-04-08T19:46:16.000+0200}, title = {A Fast Method to Estimate Through-Bump Current for Power Delivery Verification.}, url = {http://dblp.uni-trier.de/db/journals/tcad/tcad42.html#ZhuoS23}, volume = 42, year = 2023 }