%0 Journal Article %1 journals/mr/MeinshausenFWP13 %A Meinshausen, Lutz %A Frémont, Hélène %A Weide-Zaage, Kirsten %A Plano, Bernard %D 2013 %J Microelectron. Reliab. %K dblp %N 9-11 %P 1575-1580 %T Electro- and thermomigration-induced IMC formation in SnAg3.0Cu0.5 solder joints on nickel gold pads. %U http://dblp.uni-trier.de/db/journals/mr/mr53.html#MeinshausenFWP13 %V 53

@article{journals/mr/MeinshausenFWP13, added-at = {2020-02-22T00:00:00.000+0100}, author = {Meinshausen, Lutz and Frémont, Hélène and Weide-Zaage, Kirsten and Plano, Bernard}, biburl = {https://www.bibsonomy.org/bibtex/27e299bf69cf86d96d533c369b2c55cec/dblp}, ee = {https://doi.org/10.1016/j.microrel.2013.07.038}, interhash = {17b865c09551c6e224407cfb87b142f7}, intrahash = {7e299bf69cf86d96d533c369b2c55cec}, journal = {Microelectron. Reliab.}, keywords = {dblp}, number = {9-11}, pages = {1575-1580}, timestamp = {2020-02-25T13:30:08.000+0100}, title = {Electro- and thermomigration-induced IMC formation in SnAg3.0Cu0.5 solder joints on nickel gold pads.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr53.html#MeinshausenFWP13}, volume = 53, year = 2013 }