%0 Conference Paper %1 conf/iscas/JiaoDY0S18 %A Jiao, Fengxian %A Dong, Sheqin %A Yu, Bei %A Li, Bing %A Schlichtmann, Ulf %B ISCAS %D 2018 %I IEEE %K dblp %P 1-4 %T Thermal-Aware Placement and Routing for 3D Optical Networks-on-Chips. %U http://dblp.uni-trier.de/db/conf/iscas/iscas2018.html#JiaoDY0S18 %@ 978-1-5386-4881-0

@inproceedings{conf/iscas/JiaoDY0S18, added-at = {2019-09-16T00:00:00.000+0200}, author = {Jiao, Fengxian and Dong, Sheqin and Yu, Bei and Li, Bing and Schlichtmann, Ulf}, biburl = {https://www.bibsonomy.org/bibtex/2ee5e054790e1a5ab325639d09f6248b9/dblp}, booktitle = {ISCAS}, crossref = {conf/iscas/2018}, ee = {https://doi.org/10.1109/ISCAS.2018.8351101}, interhash = {21923cc4c9a807018319d92a707f6503}, intrahash = {ee5e054790e1a5ab325639d09f6248b9}, isbn = {978-1-5386-4881-0}, keywords = {dblp}, pages = {1-4}, publisher = {IEEE}, timestamp = {2019-09-17T13:03:10.000+0200}, title = {Thermal-Aware Placement and Routing for 3D Optical Networks-on-Chips.}, url = {http://dblp.uni-trier.de/db/conf/iscas/iscas2018.html#JiaoDY0S18}, year = 2018 }