%0 Conference Paper %1 conf/3dic/MurugesanBFMTK16 %A Murugesan, Mariappan %A Bea, Jichel %A Fukushima, Takafumi %A Motoyoshi, Makoto %A Tanaka, Tetsu %A Koyanagi, Mitsumasa %B 3DIC %D 2016 %I IEEE %K dblp %P 1-4 %T Improving the integrity of Ti barrier layer in Cu-TSVs through self-formed TiSix for via-last TSV technology. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2016.html#MurugesanBFMTK16 %@ 978-1-5090-1399-9

@inproceedings{conf/3dic/MurugesanBFMTK16, added-at = {2019-10-19T00:00:00.000+0200}, author = {Murugesan, Mariappan and Bea, Jichel and Fukushima, Takafumi and Motoyoshi, Makoto and Tanaka, Tetsu and Koyanagi, Mitsumasa}, biburl = {https://www.bibsonomy.org/bibtex/25681f389c6eb0c6c5b2e068eb9737514/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2016}, ee = {https://doi.org/10.1109/3DIC.2016.7970017}, interhash = {237659ce3cd3b62133beeda7e49e979f}, intrahash = {5681f389c6eb0c6c5b2e068eb9737514}, isbn = {978-1-5090-1399-9}, keywords = {dblp}, pages = {1-4}, publisher = {IEEE}, timestamp = {2019-10-22T16:17:19.000+0200}, title = {Improving the integrity of Ti barrier layer in Cu-TSVs through self-formed TiSix for via-last TSV technology.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2016.html#MurugesanBFMTK16}, year = 2016 }