Inproceedings,
A 6.9 μm Pixel-Pitch 3D Stacked Global Shutter CMOS Image Sensor with 3M Cu-Cu connections.
T. Miura, M. Sakakibara, H. Takahashi, T. Taura, K. Tatani, Y. Oike, and T. Ezaki.3DIC, page 1-2. IEEE, (2019)
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- conf/3dic/MiuraSTTTOE19
- entry type
- inproceedings
- booktitle
- 3DIC
- year
- 2019
- pages
- 1-2
- publisher
- IEEE
- crossref
- conf/3dic/2019
- ee
- https://doi.org/10.1109/3DIC48104.2019.9058832
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- 978-1-7281-4870-0
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- http://dblp.uni-trier.de/db/conf/3dic/3dic2019.html#MiuraSTTTOE19
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%1 conf/3dic/MiuraSTTTOE19
%A Miura, Tsukasa
%A Sakakibara, Masaki
%A Takahashi, Hirotsugu
%A Taura, Tadayuki
%A Tatani, Keiji
%A Oike, Yusuke
%A Ezaki, Takayuki
%B 3DIC
%D 2019
%I IEEE
%K dblp
%P 1-2
%T A 6.9 μm Pixel-Pitch 3D Stacked Global Shutter CMOS Image Sensor with 3M Cu-Cu connections.
%U http://dblp.uni-trier.de/db/conf/3dic/3dic2019.html#MiuraSTTTOE19
%@ 978-1-7281-4870-0
@inproceedings{conf/3dic/MiuraSTTTOE19,
added-at = {2020-04-19T00:00:00.000+0200},
author = {Miura, Tsukasa and Sakakibara, Masaki and Takahashi, Hirotsugu and Taura, Tadayuki and Tatani, Keiji and Oike, Yusuke and Ezaki, Takayuki},
biburl = {https://www.bibsonomy.org/bibtex/2d490f371bbff8c7d13ab5fd1cacf2820/dblp},
booktitle = {3DIC},
crossref = {conf/3dic/2019},
ee = {https://doi.org/10.1109/3DIC48104.2019.9058832},
interhash = {25c54006582f6e635aaf56fdbaf69ba9},
intrahash = {d490f371bbff8c7d13ab5fd1cacf2820},
isbn = {978-1-7281-4870-0},
keywords = {dblp},
pages = {1-2},
publisher = {IEEE},
timestamp = {2020-04-21T11:41:02.000+0200},
title = {A 6.9 μm Pixel-Pitch 3D Stacked Global Shutter CMOS Image Sensor with 3M Cu-Cu connections.},
url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2019.html#MiuraSTTTOE19},
year = 2019
}