We have developed a novel methodology to design systems composed of complementary metal–oxide–semiconductor (CMOS) and microelectromechanical systems (MEMS) parts. This multiscale methodology combines bottom-up modeling and top-down design-space exploration through the following steps: 1) In bottom-up modeling, characteristics of CMOS circuits and MEMS structures are accurately simulated at the circuit and MEMS device level; 2) on the basis of the results of a statistical regression method, these characteristics are abstracted into individual response surface models (RSMs), each with a set of coefficients of design parameters; 3) the models a…(more)
Please log in to take part in the discussion (add own reviews or comments).
Cite this publication
More citation styles
- please select -
%0 Journal Article
%1 citeulike:9386156
%A Sato, Norio
%A Sato, Yasuhiro
%A Kado, Yuichi
%A Ciappa, Mauro
%A Aemmer, Dölf
%A Kaeslin, Hubert
%A Fichtner, Wolfgang
%D 2011
%J Journal of Microelectromechanical Systems
%K mems 93b51-systems-theory-design-techniques 62k20-response-surface-designs
%R 10.1109/jmems.2011.2140352
%T A Multilevel CMOS&\#x02013;MEMS Design Methodology Based on Response Surface Models
%U http://dx.doi.org/10.1109/jmems.2011.2140352
%X We have developed a novel methodology to design systems composed of complementary metal–oxide–semiconductor (CMOS) and microelectromechanical systems (MEMS) parts. This multiscale methodology combines bottom-up modeling and top-down design-space exploration through the following steps: 1) In bottom-up modeling, characteristics of CMOS circuits and MEMS structures are accurately simulated at the circuit and MEMS device level; 2) on the basis of the results of a statistical regression method, these characteristics are abstracted into individual response surface models (RSMs), each with a set of coefficients of design parameters; 3) the models are mathematically connected to describe an elemental unit comprising CMOS and MEMS components; 4) the characteristics of the whole system of elemental units are abstracted into another RSM to cover the system performance; and 5) in top-down design-space exploration, the system requirements are connected to a set of design parameters for the CMOS circuits and MEMS structures by utilizing the RSMs in the reverse direction. To verify the concept, our design methodology was applied to a CMOS–MEMS fingerprint sensor. \$hfill\$ 2010-0084
@article{citeulike:9386156,
abstract = {{We have developed a novel methodology to design systems composed of complementary metal–oxide–semiconductor (CMOS) and microelectromechanical systems (MEMS) parts. This multiscale methodology combines bottom-up modeling and top-down design-space exploration through the following steps: 1) In bottom-up modeling, characteristics of CMOS circuits and MEMS structures are accurately simulated at the circuit and MEMS device level; 2) on the basis of the results of a statistical regression method, these characteristics are abstracted into individual response surface models (RSMs), each with a set of coefficients of design parameters; 3) the models are mathematically connected to describe an elemental unit comprising CMOS and MEMS components; 4) the characteristics of the whole system of elemental units are abstracted into another RSM to cover the system performance; and 5) in top-down design-space exploration, the system requirements are connected to a set of design parameters for the CMOS circuits and MEMS structures by utilizing the RSMs in the reverse direction. To verify the concept, our design methodology was applied to a CMOS–MEMS fingerprint sensor. \$hfill\$ [2010-0084]}},
added-at = {2017-06-29T07:13:07.000+0200},
author = {Sato, Norio and Sato, Yasuhiro and Kado, Yuichi and Ciappa, Mauro and Aemmer, D\"{o}lf and Kaeslin, Hubert and Fichtner, Wolfgang},
biburl = {https://www.bibsonomy.org/bibtex/226d5d305c4989ac77fb4f95e8e6da441/gdmcbain},
citeulike-article-id = {9386156},
citeulike-attachment-1 = {sato_11_multilevel.pdf; /pdf/user/gdmcbain/article/9386156/660358/sato_11_multilevel.pdf; 569bb8a4404c6f526c8e8af55a13d5f6e9548a26},
citeulike-linkout-0 = {http://dx.doi.org/10.1109/jmems.2011.2140352},
citeulike-linkout-1 = {http://ieeexplore.ieee.org/xpls/abs\_all.jsp?arnumber=5764817},
doi = {10.1109/jmems.2011.2140352},
file = {sato_11_multilevel.pdf},
interhash = {12797543870465dfc764d95a7df8ad4a},
intrahash = {26d5d305c4989ac77fb4f95e8e6da441},
issn = {1057-7157},
journal = {Journal of Microelectromechanical Systems},
keywords = {mems 93b51-systems-theory-design-techniques 62k20-response-surface-designs},
posted-at = {2011-06-06 03:01:02},
priority = {2},
timestamp = {2021-05-05T06:59:05.000+0200},
title = {{A Multilevel CMOS\&\#x02013;MEMS Design Methodology Based on Response Surface Models}},
url = {http://dx.doi.org/10.1109/jmems.2011.2140352},
year = 2011
}