%0 Conference Paper %1 conf/isqed/AlamJPJ09 %A Alam, Syed M. %A Jones, Robert E. %A Pozder, Scott %A Jain, Ankur %B ISQED %D 2009 %I IEEE Computer Society %K dblp %P 569-575 %T Die/wafer stacking with reciprocal design symmetry (RDS) for mask reuse in three-dimensional (3D) integration technology. %U http://dblp.uni-trier.de/db/conf/isqed/isqed2009.html#AlamJPJ09 %@ 978-1-4244-2952-3

@inproceedings{conf/isqed/AlamJPJ09, added-at = {2023-03-23T00:00:00.000+0100}, author = {Alam, Syed M. and Jones, Robert E. and Pozder, Scott and Jain, Ankur}, biburl = {https://www.bibsonomy.org/bibtex/2188ff0cc93963d0f0fdf5dc0f9b2b418/dblp}, booktitle = {ISQED}, crossref = {conf/isqed/2009}, ee = {https://doi.ieeecomputersociety.org/10.1109/ISQED.2009.4810357}, interhash = {2d77633655d7ddfd90aefbbedec4775d}, intrahash = {188ff0cc93963d0f0fdf5dc0f9b2b418}, isbn = {978-1-4244-2952-3}, keywords = {dblp}, pages = {569-575}, publisher = {IEEE Computer Society}, timestamp = {2024-04-10T14:09:30.000+0200}, title = {Die/wafer stacking with reciprocal design symmetry (RDS) for mask reuse in three-dimensional (3D) integration technology.}, url = {http://dblp.uni-trier.de/db/conf/isqed/isqed2009.html#AlamJPJ09}, year = 2009 }