%0 Conference Paper %1 conf/3dic/DerakhshandehHP16 %A Derakhshandeh, Jaber %A Hou, Lin %A Preter, Inge De %A Gerets, Carine %A Suhard, Samuel %A Dubey, Vikas %A Jamieson, Geraldine %A Inoue, Fumihiro %A Webers, Tomas %A Bex, Pieter %A Capuz, Giovanni %A Beyne, Eric %A Slabbekoorn, John %A Wang, Teng %A Jourdain, Anne %A Beyer, Gerald %A Rebibis, Kenneth June %A Miller, Andy %B 3DIC %D 2016 %I IEEE %K dblp %P 1-4 %T Die to wafer 3D stacking for below 10um pitch microbumps. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2016.html#DerakhshandehHP16 %@ 978-1-5090-1399-9

@inproceedings{conf/3dic/DerakhshandehHP16, added-at = {2021-10-14T00:00:00.000+0200}, author = {Derakhshandeh, Jaber and Hou, Lin and Preter, Inge De and Gerets, Carine and Suhard, Samuel and Dubey, Vikas and Jamieson, Geraldine and Inoue, Fumihiro and Webers, Tomas and Bex, Pieter and Capuz, Giovanni and Beyne, Eric and Slabbekoorn, John and Wang, Teng and Jourdain, Anne and Beyer, Gerald and Rebibis, Kenneth June and Miller, Andy}, biburl = {https://www.bibsonomy.org/bibtex/2222b71815bfa4aac742228b2341fe3db/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2016}, ee = {https://doi.org/10.1109/3DIC.2016.7969993}, interhash = {386f5b44a796aca41c54e45c854ca096}, intrahash = {222b71815bfa4aac742228b2341fe3db}, isbn = {978-1-5090-1399-9}, keywords = {dblp}, pages = {1-4}, publisher = {IEEE}, timestamp = {2024-04-10T12:11:01.000+0200}, title = {Die to wafer 3D stacking for below 10um pitch microbumps.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2016.html#DerakhshandehHP16}, year = 2016 }