Inproceedings,
Interconnects in the Third Dimension: Design Challenges for 3D ICs.
K. Bernstein, P. Andry, J. Cann, P. Emma, D. Greenberg, W. Haensch, M. Ignatowski, S. Koester, J. Magerlein, R. Puri, and A. Young.DAC, page 562-567. IEEE, (2007)
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- conf/dac/BernsteinACEGHIKMPY07
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- inproceedings
- booktitle
- DAC
- year
- 2007
- pages
- 562-567
- publisher
- IEEE
- crossref
- conf/dac/2007
- ee
- https://doi.org/10.1145/1278480.1278623
- url
- http://dblp.uni-trier.de/db/conf/dac/dac2007.html#BernsteinACEGHIKMPY07
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%1 conf/dac/BernsteinACEGHIKMPY07
%A Bernstein, Kerry
%A Andry, Paul S.
%A Cann, Jerome
%A Emma, Philip G.
%A Greenberg, David
%A Haensch, Wilfried
%A Ignatowski, Mike
%A Koester, Steven J.
%A Magerlein, John
%A Puri, Ruchir
%A Young, Albert M.
%B DAC
%D 2007
%I IEEE
%K dblp
%P 562-567
%T Interconnects in the Third Dimension: Design Challenges for 3D ICs.
%U http://dblp.uni-trier.de/db/conf/dac/dac2007.html#BernsteinACEGHIKMPY07
@inproceedings{conf/dac/BernsteinACEGHIKMPY07,
added-at = {2021-09-19T00:00:00.000+0200},
author = {Bernstein, Kerry and Andry, Paul S. and Cann, Jerome and Emma, Philip G. and Greenberg, David and Haensch, Wilfried and Ignatowski, Mike and Koester, Steven J. and Magerlein, John and Puri, Ruchir and Young, Albert M.},
biburl = {https://www.bibsonomy.org/bibtex/21dec3914ff43ede9cc4d88db4f7e0bb5/dblp},
booktitle = {DAC},
crossref = {conf/dac/2007},
ee = {https://doi.org/10.1145/1278480.1278623},
interhash = {404dacef6626adac24164be35cee199e},
intrahash = {1dec3914ff43ede9cc4d88db4f7e0bb5},
keywords = {dblp},
pages = {562-567},
publisher = {IEEE},
timestamp = {2024-04-10T06:50:22.000+0200},
title = {Interconnects in the Third Dimension: Design Challenges for 3D ICs.},
url = {http://dblp.uni-trier.de/db/conf/dac/dac2007.html#BernsteinACEGHIKMPY07},
year = 2007
}