%0 Generic %1 Hagiwara1998 %A Hagiwara, S. %A Saitoh, H. %A Sashima, H. %A Huber, P. %A Deubzer, B. %A Geck, M. %D 1998 %K imported %N 5739217 %T Epoxy resin molding for sealing electronic parts containing organic polymer-grafted silicone %U http://www.freepatentsonline.com/5739217.html

@patent{Hagiwara1998, added-at = {2009-11-05T12:01:24.000+0100}, author = {Hagiwara, S. and Saitoh, H. and Sashima, H. and Huber, P. and Deubzer, B. and Geck, M.}, bibtexkey = {Hagiwara1998}, biburl = {https://www.bibsonomy.org/bibtex/28e926a91a0382acaadafd6c5d005ed48/ghuot}, file = {Hagiwara1998.pdf:composite\\Hagiwara1998.pdf:PDF}, interhash = {42bb8b97dbc67e99e8e6dcb621df0577}, intrahash = {8e926a91a0382acaadafd6c5d005ed48}, keywords = {imported}, month = {April}, number = 5739217, timestamp = {2009-11-05T12:01:28.000+0100}, title = {Epoxy resin molding for sealing electronic parts containing organic polymer-grafted silicone}, url = {http://www.freepatentsonline.com/5739217.html}, year = 1998 }