A Method for Deembedding the Mounting Pad and Via-Hole Effect in a Test Fixture for Accurate Impedance Measurement of the Surface Mount Device Component.
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%0 Journal Article
%1 journals/tim/LeeKARCKA24
%A Lee, Sanguk
%A Kim, Hyunwoong
%A Ahn, Jangyong
%A Rhee, Jaewon
%A Cho, Jaeyong
%A Kim, Hongseok
%A Ahn, Seungyoung
%D 2024
%J IEEE Trans. Instrum. Meas.
%K dblp
%P 1-13
%T A Method for Deembedding the Mounting Pad and Via-Hole Effect in a Test Fixture for Accurate Impedance Measurement of the Surface Mount Device Component.
%U http://dblp.uni-trier.de/db/journals/tim/tim73.html#LeeKARCKA24
%V 73
@article{journals/tim/LeeKARCKA24,
added-at = {2024-05-31T00:00:00.000+0200},
author = {Lee, Sanguk and Kim, Hyunwoong and Ahn, Jangyong and Rhee, Jaewon and Cho, Jaeyong and Kim, Hongseok and Ahn, Seungyoung},
biburl = {https://www.bibsonomy.org/bibtex/29547dc058bd38b011f68dc777b9a4e9b/dblp},
ee = {https://doi.org/10.1109/TIM.2024.3394503},
interhash = {42e6bbe3044ccf38da04fba013192b7d},
intrahash = {9547dc058bd38b011f68dc777b9a4e9b},
journal = {IEEE Trans. Instrum. Meas.},
keywords = {dblp},
pages = {1-13},
timestamp = {2024-06-03T07:05:26.000+0200},
title = {A Method for Deembedding the Mounting Pad and Via-Hole Effect in a Test Fixture for Accurate Impedance Measurement of the Surface Mount Device Component.},
url = {http://dblp.uni-trier.de/db/journals/tim/tim73.html#LeeKARCKA24},
volume = 73,
year = 2024
}
