%0 Conference Paper %1 conf/3dic/VollebregtICB11 %A Vollebregt, Sten %A Ishihara, Ryoichi %A van der Cingel, Johan %A Beenakker, Kees %B 3DIC %D 2011 %E Koyanagi, Mitsumasa %E Kada, Morihiro %I IEEE %K dblp %P 1-4 %T Low-temperature bottom-up integration of carbon nanotubes for vertical interconnects in monolithic 3D integrated circuits. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2011.html#VollebregtICB11 %@ 978-1-4673-2189-1

@inproceedings{conf/3dic/VollebregtICB11, added-at = {2017-05-29T00:00:00.000+0200}, author = {Vollebregt, Sten and Ishihara, Ryoichi and van der Cingel, Johan and Beenakker, Kees}, biburl = {https://www.bibsonomy.org/bibtex/25615508e60d765b2656ad90aaddec228/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2011}, editor = {Koyanagi, Mitsumasa and Kada, Morihiro}, ee = {https://doi.org/10.1109/3DIC.2012.6262989}, interhash = {14506c85b7ac171db563e49ad9726ef0}, intrahash = {5615508e60d765b2656ad90aaddec228}, isbn = {978-1-4673-2189-1}, keywords = {dblp}, pages = {1-4}, publisher = {IEEE}, timestamp = {2019-10-17T15:31:14.000+0200}, title = {Low-temperature bottom-up integration of carbon nanotubes for vertical interconnects in monolithic 3D integrated circuits.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2011.html#VollebregtICB11}, year = 2011 }