%0 Journal Article %1 journals/tcasII/ChenCRYQ21 %A Chen, Xiliang %A Chen, Wenjie %A Ren, Yu %A Yang, Xu %A Qiao, Liang %D 2021 %J IEEE Trans. Circuits Syst. II Express Briefs %K dblp %N 6 %P 2077-2081 %T DM Interference Propagation Mathematical Modeling in SiC Wirebond Multichip Power Module. %U http://dblp.uni-trier.de/db/journals/tcasII/tcasII68.html#ChenCRYQ21 %V 68

@article{journals/tcasII/ChenCRYQ21, added-at = {2021-09-06T00:00:00.000+0200}, author = {Chen, Xiliang and Chen, Wenjie and Ren, Yu and Yang, Xu and Qiao, Liang}, biburl = {https://www.bibsonomy.org/bibtex/27165365b56ac3e28fe4ddd7926422aec/dblp}, ee = {https://doi.org/10.1109/TCSII.2020.3041675}, interhash = {5575f8384ffd83f3152ea093386d2b08}, intrahash = {7165365b56ac3e28fe4ddd7926422aec}, journal = {IEEE Trans. Circuits Syst. II Express Briefs}, keywords = {dblp}, number = 6, pages = {2077-2081}, timestamp = {2024-04-08T16:52:52.000+0200}, title = {DM Interference Propagation Mathematical Modeling in SiC Wirebond Multichip Power Module.}, url = {http://dblp.uni-trier.de/db/journals/tcasII/tcasII68.html#ChenCRYQ21}, volume = 68, year = 2021 }