%0 Conference Paper %1 conf/3dic/FranzonWL10 %A Franzon, Paul D. %A Wilson, John M. %A Li, Ming %B 3DIC %D 2010 %I IEEE %K dblp %P 1-4 %T Thermal isolation in 3D chip stacks using vacuum gaps and capacitive or inductive communications. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2010.html#FranzonWL10 %@ 978-1-4577-0526-7

@inproceedings{conf/3dic/FranzonWL10, added-at = {2019-10-19T00:00:00.000+0200}, author = {Franzon, Paul D. and Wilson, John M. and Li, Ming}, biburl = {https://www.bibsonomy.org/bibtex/22e774d2fad7796a50af4349ceef8782e/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2010}, ee = {https://doi.org/10.1109/3DIC.2010.5751431}, interhash = {65085c0fc03f36a103b7ebefa7e567ce}, intrahash = {2e774d2fad7796a50af4349ceef8782e}, isbn = {978-1-4577-0526-7}, keywords = {dblp}, pages = {1-4}, publisher = {IEEE}, timestamp = {2019-10-22T16:17:20.000+0200}, title = {Thermal isolation in 3D chip stacks using vacuum gaps and capacitive or inductive communications.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2010.html#FranzonWL10}, year = 2010 }