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%0 Conference Paper
%1 conf/3dic/FranzonWL10
%A Franzon, Paul D.
%A Wilson, John M.
%A Li, Ming
%B 3DIC
%D 2010
%I IEEE
%K dblp
%P 1-4
%T Thermal isolation in 3D chip stacks using vacuum gaps and capacitive or inductive communications.
%U http://dblp.uni-trier.de/db/conf/3dic/3dic2010.html#FranzonWL10
%@ 978-1-4577-0526-7
@inproceedings{conf/3dic/FranzonWL10,
added-at = {2019-10-19T00:00:00.000+0200},
author = {Franzon, Paul D. and Wilson, John M. and Li, Ming},
biburl = {https://www.bibsonomy.org/bibtex/22e774d2fad7796a50af4349ceef8782e/dblp},
booktitle = {3DIC},
crossref = {conf/3dic/2010},
ee = {https://doi.org/10.1109/3DIC.2010.5751431},
interhash = {65085c0fc03f36a103b7ebefa7e567ce},
intrahash = {2e774d2fad7796a50af4349ceef8782e},
isbn = {978-1-4577-0526-7},
keywords = {dblp},
pages = {1-4},
publisher = {IEEE},
timestamp = {2019-10-22T16:17:20.000+0200},
title = {Thermal isolation in 3D chip stacks using vacuum gaps and capacitive or inductive communications.},
url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2010.html#FranzonWL10},
year = 2010
}