%0 Conference Paper %1 conf/3dic/OharaLFTK11 %A Ohara, Yuki %A Lee, Kang Wook %A Fukushima, Takafumi %A Tanaka, Tetsu %A Koyanagi, Mitsumasa %B 3DIC %D 2011 %E Koyanagi, Mitsumasa %E Kada, Morihiro %I IEEE %K dblp %P 1-4 %T Novel detachable bonding process with wettability control of bonding surface for versatile chip-level 3D integration. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2011.html#OharaLFTK11 %@ 978-1-4673-2189-1

@inproceedings{conf/3dic/OharaLFTK11, added-at = {2021-02-16T00:00:00.000+0100}, author = {Ohara, Yuki and Lee, Kang Wook and Fukushima, Takafumi and Tanaka, Tetsu and Koyanagi, Mitsumasa}, biburl = {https://www.bibsonomy.org/bibtex/28a7b209c34cac45569a1419e8ce99753/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2011}, editor = {Koyanagi, Mitsumasa and Kada, Morihiro}, ee = {https://doi.org/10.1109/3DIC.2012.6262950}, interhash = {690d7c7635eb4c5b621f32f0c8bf4f28}, intrahash = {8a7b209c34cac45569a1419e8ce99753}, isbn = {978-1-4673-2189-1}, keywords = {dblp}, pages = {1-4}, publisher = {IEEE}, timestamp = {2024-04-10T12:11:22.000+0200}, title = {Novel detachable bonding process with wettability control of bonding surface for versatile chip-level 3D integration.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2011.html#OharaLFTK11}, year = 2011 }