%0 Conference Paper %1 conf/3dic/RittinonSM15 %A Rittinon, Pornvitoo %A Suzuki, Ken %A Miura, Hideo %B 3DIC %D 2015 %I IEEE %K dblp %P TS4.2.1-TS4.2.6 %T Thermal stability of electroplated copper thin-film interconnections. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2015.html#RittinonSM15 %@ 978-1-4673-9385-0

@inproceedings{conf/3dic/RittinonSM15, added-at = {2023-09-30T00:00:00.000+0200}, author = {Rittinon, Pornvitoo and Suzuki, Ken and Miura, Hideo}, biburl = {https://www.bibsonomy.org/bibtex/2c08f467a3c750870abff71521efc5927/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2015}, ee = {https://doi.org/10.1109/3DIC.2015.7334560}, interhash = {6ce2e070828931d56efae09dddc6e23d}, intrahash = {c08f467a3c750870abff71521efc5927}, isbn = {978-1-4673-9385-0}, keywords = {dblp}, pages = {TS4.2.1-TS4.2.6}, publisher = {IEEE}, timestamp = {2024-04-10T12:10:59.000+0200}, title = {Thermal stability of electroplated copper thin-film interconnections.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2015.html#RittinonSM15}, year = 2015 }