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%0 Conference Paper
%1 conf/irps/DingPLZCFWC23
%A Ding, Youqi
%A Pedreira, O. Varela
%A Lofrano, Melina
%A Zahedmanesh, Houman
%A Chavez, T.
%A Farr, Hosain
%A Wolf, Ingrid De
%A Croes, Kris
%B IRPS
%D 2023
%I IEEE
%K dblp
%P 1-7
%T Thermomigration-induced void formation in Cu-interconnects - Assessment of main physical parameters.
%U http://dblp.uni-trier.de/db/conf/irps/irps2023.html#DingPLZCFWC23
%@ 978-1-6654-5672-2
@inproceedings{conf/irps/DingPLZCFWC23,
added-at = {2024-05-07T00:00:00.000+0200},
author = {Ding, Youqi and Pedreira, O. Varela and Lofrano, Melina and Zahedmanesh, Houman and Chavez, T. and Farr, Hosain and Wolf, Ingrid De and Croes, Kris},
biburl = {https://www.bibsonomy.org/bibtex/2807a71ce47c8cef865f6d2c7cb8d61c2/dblp},
booktitle = {IRPS},
crossref = {conf/irps/2023},
ee = {https://doi.org/10.1109/IRPS48203.2023.10117870},
interhash = {7128c2f3d6de838dc608eed633abc4bb},
intrahash = {807a71ce47c8cef865f6d2c7cb8d61c2},
isbn = {978-1-6654-5672-2},
keywords = {dblp},
pages = {1-7},
publisher = {IEEE},
timestamp = {2024-05-13T09:41:11.000+0200},
title = {Thermomigration-induced void formation in Cu-interconnects - Assessment of main physical parameters.},
url = {http://dblp.uni-trier.de/db/conf/irps/irps2023.html#DingPLZCFWC23},
year = 2023
}
